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Solder balls appear when solder paste becomes unmixed or is stored incorrectly. These can lead to shorts if they are in sensitive areas of the PCB. Solder Balling: Solder balls are small, unintended solder deposits that can occur during reflow soldering resulting from incomplete melting and flow of solder paste. This can present as an intermittent or open connection. Insufficient Solder: Inadequate solder can lead to incomplete or weak solder joints which in turn leads to poor electrical connection. This could be between adjacent pins, pads or circuit traces. Solder Bridging/Short Circuits: This defect occurs when solder connects two or more conductive features, causing unintended electrical connections. Looking forward to future blogs, we will examine these defects from a manufacturability perspective to help bridge the gap between PCB design and assembly. Then we will drill down into a specific defect, warpage of the PCB and components and look at how PCB design can influence this defect. In this blog we will look at an overview of the most common assembly defects, some that PCB design can influence and some that are related specifically to the assembly process itself. Yet, even the most carefully designed printed circuit boards can face defects during PCB fabrication and assembly. PCB designers are the architects behind the technology that powers our modern electronics, balancing a host of requirements, navigating a complex layout that is as much art as it is science.
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